Markets

Smart Terminal

The thin, light and smaller are driving the mobile and tablet market. Biometrics and artificial intelligence are also becoming an integral part of these devices. It’s PCB solution revolutionized from through holes to high-level design like buried vias and blind via and more and more fine trace.

HDI and FPC, with benefits of higher routing density, bending ability of million times, flexibility but lighter and thinner, are the primary PCB technologies that facilitate these drivers. HDI utilizes fine feature technology to connect components in small packages.

FPC (Flex) uses flexible, polyimide substrates to provide functional, electrical connectivity within small packages, which can move or fold freely within the limited spacing and get the 3D assembly.

Kinwong has technology solutions to facilitate these products:

  • HDI/Any-layer/mSAP
  • Fine line and multilayer manufacture capability
  • Advanced SMT and after assembly equipment
  • Exquisite craft
  • Isolated function test capability
  • Low loss material
  • 5G Antenna Experience
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